AZ P4000 Series Photoresists are general purpose i-line/h-line/g-line sensitive materials engineered for performance in most electro-plating and other metal deposition process environments. AZ P4000 resists exhibit excellent adhesion to metal seed layers and compatibility with nearly all plating solutions including gold-cyanide. Plating bath lives are maximized thanks to P4000's unique PAC chemistry which prevents leaching of the DNQ. Coated thickness range is approximately 1.0 to 9µm (single coat). Optimized for the AZ 400K developers (AZ 400K 1:4 or AZ 400K 1:3) or AZ 421K developer. MIF developers not recommended.
100mm Si Wafers
Items in this series
AZ P4110 Photoresist (Quart)
AZ P4110 Photoresist (Gallon)
AZ P4210 Photoresist (Quart)
AZ P4210 Photoresist (Gallon)
AZ P4330 Photoresist (Quart)
AZ P4330 Photoresist (Gallon)
AZ P4400 Photoresist (Quart)
AZ P4400 Photoresist (Gallon)
AZ P4620 Photoresist (Quart)
AZ P4620 Photoresist (Gallon)
AZ P4903 Photoresist (Gallon)
Typical Process
Soft Bake: 110C
Expose: g-line/i-line/h-line
Post Expose Bake: Optional
Develop: spray/immersion
Develop: AZ 400K 1:3 or AZ 400K 1:4
90µm Au bump plated in P4620
28µm resist film thickness
Cyanide Gold Plating Solution