AZ® 300T Photoresist Stripper
AZ 300T Photoresist Stripper is an effective NMP based remover with additives to assist in the cleaning of organic contaminants and residues formed during RIE etching of Aluminum and Aluminum alloy substrates. AZ 300T also features low vapor pressure/high flash point, long bath life, water rinse compatibility and complete photoresist dissolution.
AZ® 400T Photoresist Stripper
AZ 400T Photoresist stripper is formulated with a higher NMP concentration vs. 300T for complete dissolution of heavily cross linked (plasma processed) positive tone resists and difficult to remove negative tone photoresists.
AZ® Kwik Strip Photoresist Remover
AZ Kwik Strip is a unique safe solvent, neutral pH stripper that removes photoresist with no attack on highly sensitive substrates. Kwik Strip is non-corrosive to Cu, GaAs, TiW, Cu/Al alloys and most metal oxides. Kwik Strip is also amine free (no NMP), water rinsable, biodegradable and contains no S.A.R.A recordable chemicals.
AZ® NMP Rinse
AZ NMP rinse is high purity n-methylpyrrolidone and provides a fast economical method for photoresist removal. Due to its’ low vapor pressure and high boiling point, NMP can be safely heated to improve stripping rate and photoresist dissolution effectiveness.
AZ® Remover 910
AZ Remover 910 is an advanced blend of proprietary solvents formulated to fully dissolved cross linked negative tone resist materials like AZ 15nXT. Remover 910 is NMP and DMSO-free, water rinsable, and fully REACH complaint.
Dynastrip 7700
Dynastrip 7700 is a uniquely formulated photoresist remover designed specifically for thick resists (dry film or liquid) used in wafer level packaging (WLP), MEMs, and other applications including lead-free solder bumping, µ-bumping, and Cu pillar. This remover is recommended for use with AZ® 125nXT-10B and other cross linking type photoresists. NMP-free and REACH compliant.
Dynastrip DL9150B
Dynastrip DL9150B is a TMAH-free solution designed specifically to remove plasma processed photoresists and post silicon etch residues. It is effective with both positive and negative tone (liquid or dry film) photoresists and on organometallic residues formed during silicon etch processes (Bosch Etch).