AZ MiR 701 Series Spin Curves

AZ® MiR 701 Series Photoresists

AZ MiR 701 Series Photoresists are high resolution (0.35um design rules), i-line resists optimized for line/space and contact hole pattern layers. Low exposure dose requirements provide excellent throughput. Reliable performance in both dry and wet etch process environments. The MiR 701 Series covers a coated thickness range of approximately 0.5 to 2.5µm and works well with MIF developers (AZ 300MIF or AZ 726MIF recommended)

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Typical Process

Soft Bake: 90C (60s)     Expose: i-line/broadband  Post Expose Bake: 110C     Develop: spray or puddle      Developer: MIF recommended

Lines in MiR 7010.32µm Lines in AZ MIR 701         0.97µm film thickness              180mJ/cm2 i-line exposure     0.60NA Stepper                            AZ 300MIF Develop