AZ 15nXT Series Spin Curves

AZ® 15nXT 115cps Photoresist

AZ 15nXT Series Photoresists are cross linking negative tone materials optimized for use in plating, TSV, RIE etch and high energy implant applications. The fully cross linked features are extremely thermally stable and etch resistant, yet strip quickly and easily in most common photoresist removers (AZ 400T Stripper recommended). The 115cps version covers a coated film thickness range of approximately 3.5 to 6.0µm. Develop is very fast in standard MIF Developers (less than 2 minutes in AZ 300MIF for a resist film thickness of 6.0µm). No post bake re-hydration delay required. 

Items in this series:

  • AZ 15nXT 115cps Photoresist (Quart)
  • AZ 15nXT 115cps Photoresist (Gallon)
  • AZ 15nXT 450cps Photoresist (Quart)
  • AZ 15nXT 450cps Photoresist (Gallon)

 

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Typical Process

Soft Bake: 110C (60-120s) Expose: i-line or broadband Post Expose Bake: 120C     Develop: spray or puddle Developer: AZ 300MIF

2.5µm Lines in AZ 15nXT on Cu     6.0µm film thickness              300mJ/cm2 i-line exposure    0.54NA Stepper                            AZ 300MIF Develop (110s)