AZ 40XT-11D Photoresist is a thick chemically amplified resist optimized for MEMs, packaging (solder bump, etc.), and deep RIE etch applications. Single coat film thicknesses up to 80µm are achievable on standard coating equipment. Superior adhesion to Cu substrates prevents under-plating and removal is easy using AZ 400T Stripper. Compatible with organic developers (AZ 300MIF or AZ 917MIF are recommended).
200mm Si Wafers
Items in this series
AZ 40XT-11D Photoresist (Quart)
AZ 40XT-11D Photoresist (Gallon)
Typical Process
Soft Bake: 85-125C ramped
Expose: 365nm
Post Expose Bake: Required
Develop: spray/immersion
Developer: AZ 300MIF
Holes in AZ 40XT-11D
45µm film thickness
600mJ/cm2 i-line
Suss ACS 300 Plus
AZ 300MIF Develop