AZ® 50XT Photoresist

AZ 50XT Photoresist is a thick DNQ type resist optimized for MEMs and packaging (solder bump, etc.) applications. Single coat film thicknesses of 15 to 65µm are achievable on standard coating equipment. Superior adhesion to Cu substrates prevents under-plating and removal is easy using AZ 400T Stripper. Compatible with inorganic developers (AZ 421K or AZ 400K 1:3 recommended).

 

Items in this series:

  • AZ 50XT Photoresist (Quart)
  • AZ 50XT Photoresist (Gallon)

 

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Typical Process

Soft Bake: 85/125C           Expose: broadband         Post Expose Bake: None     Develop: spray/immersion  Developer: AZ 421K

60µm holes in AZ 50XT              65µm film thickness              1400mJ/cm2 broadband              Suss MA 200 aligner                    AZ 421K Develop