AZ® IPS-6000 Series Photoresist

AZ IPS-6000 is an advanced chemically amplified positive tone photoresist optimized for use in high aspect ratio plating, MEMs, and extreme RIE etch applications. AZ IPS-6000 is fast, MIF developer compatible and requires no post bake re-hydration delays. Film thicknesses from 20 to 120+µm are achievable. Develop in AZ 300MIF or 917MIF developer. Strips easily in AZ 400T Stripper.

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Typical Process

Soft Bake: 125C               Expose: i-line or broadband PEB: 105C                    Develop: spray/puddle     Developer: AZ 300MIF

 60µm Cu stud post strip