AZ 1500 Series Photoresists are general purpose, g-line/broadband sensitive materials optimized for substrate adhesion in wet etch process environments. Available in both dyed and un-dyed versions, this series covers a coated thickness range of approximately 0.4 to 5.0µm and works well with both organic (MIF) and inorganic developers (AZ Developer or AZ 400K Developers). AZ 1500 Series resists are fast, economical and industry proven over more than 25 years.

AZ 1500 Series Spin Curves

6" Si Wafers; Soft Bake 90C/60s

Items in this series

AZ 1505 Photoresist (Gallon)

AZ 1512 Photoresist (Quart)

AZ 1512 Photoresist (Gallon)

AZ 1518 Photoresist (Gallon)

AZ 1518 Photoresist (10L)

AZ 1518-SFD Photoresist (Gallon)

AZ 1529 Photoresist (Gallon)

Typical Process

Soft Bake: 90-105C (60s)

Expose: g-line or broadband

Post Expose Bake: Optional

Develop: spray, puddle or immersion

Developer: MIF or IN

Lines in 1500

1.0µm Lines in AZ® 1518

2.4µm film thickness     

150mJ/cm2 g-line exposure

AZ 300MIF Develop