AZ 1500 Series Photoresists are general purpose, g-line/broadband sensitive materials optimized for substrate adhesion in wet etch process environments. Available in both dyed and un-dyed versions, this series covers a coated thickness range of approximately 0.4 to 5.0µm and works well with both organic (MIF) and inorganic developers (AZ Developer or AZ 400K Developers). AZ 1500 Series resists are fast, economical and industry proven over more than 25 years.
6" Si Wafers; Soft Bake 90C/60s
Items in this series
AZ 1505 Photoresist (Gallon)
AZ 1512 Photoresist (Quart)
AZ 1512 Photoresist (Gallon)
AZ 1518 Photoresist (Gallon)
AZ 1518 Photoresist (10L)
AZ 1518-SFD Photoresist (Gallon)
AZ 1529 Photoresist (Gallon)
Typical Process
Soft Bake: 90-105C (60s)
Expose: g-line or broadband
Post Expose Bake: Optional
Develop: spray, puddle or immersion
Developer: MIF or IN
1.0µm Lines in AZ® 1518
2.4µm film thickness
150mJ/cm2 g-line exposure
AZ 300MIF Develop