| Thick Photoresist Application Guide (5-100μm) |
Coated Film Thickness Range (μm) | ||||||||||
| Application | Resist (Developer Type) | Exposure λ (nm) | 5.0 | 7.0 | 10.0 | 20.0 | 30.0 | 40.0 | 50.0 | 70.0 | 100+ |
| Thick Metal Lift-Off | AZ nLoF 2070 (MIF) | 365 | |||||||||
| TSV, RIE Etch, High Energy Implant, Plating (Cu,Au,Ni) (5-30μm) | AZ 15nXT 115cps (MIF) | 365 | |||||||||
| AZ 10XT (IN) | 350-405 | ||||||||||
| AZ 15nXT-450cps (MIF) | 365 | ||||||||||
| AZ 12XT-20PL-05 (MIF) | 365 | ||||||||||
| AZ 12XT-20PL-10 (MIF) | 365 | ||||||||||
| AZ 12XT-20PL-15 (MIF) | 365 | ||||||||||
| AZ P4620 (IN) | 400-440 | ||||||||||
| AZ 125nXT-7A (MIF) | 365-435 | ||||||||||
| Plating (Cu, Pb, Ni) MEMs (25-100+ μm) | AZ IPS-6000 (MIF) | 365-435 | |||||||||
| AZ 40XT-11D (MIF) | 400-440 | ||||||||||
| AZ 125nXT-10B (MIF) | 365-435 | ||||||||||
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