AZ® TX-1311 High Aspect Ratio DUV Photoresist

AZ TX-1311 is a fast, high resolution, chemically amplified DUV photoresist for critical line/space and hole applications in KrF laser (248nm) lithography. Ultra-high aspect ratios are ideal for plasma etch, high energy implant, and plating applications. Images develop quickly and easily in standard MIF type developers (AZ 300MIF recommended). Coated thickness range is approximately 2.0 to 4.0µm.







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