EM SML Series are positive tone e-beam resists featuring high sensitivity and ultra-high resolution. These resists feature a novel, low etch rate polymer and imaging at up to 50:1 aspect ratios. Available viscosities cover a coated thickness range of approximately 50 to > 3,000nm.
Also available are PMMA resins and copolymers. PMMA materials range in molecular weight from 35K to 950K.
33nm Spaces in 400nm EM SML300
Typical Process
Soft Bake: 180C (120s)
Expose: e-beam
PEB: None
Develop: Puddle or immersion
Developer: MIBK:IPA (1:3)
5nm spaces in SML 50 50nm film thickness 30keV e-beam exposure
Click the e-mail link below or contact your IMM representative for further information on SML, PMMA, HSQ, and ancillary processing materials.