AZ 3300 Photoresists are medium resolution (0.65um design rules), high thermal stability materials optimized for metal RIE etch or plating process environments. Fast in all exposure wavelengths between 350 and 450nm. The 3300 Series covers a coated thickness range of approximately 1.0 to 5.0µm and works well with both organic (MIF) and inorganic developers (AZ Developer or AZ 400K 1:4). Improved resolution and thermal stability vs. AZ 1500 Series.

AZ 3300 Series Spin Curves

6" Si Wafers; Soft Bake 90C

Items in this series

AZ 3312 Photoresist (Gallon)

AZ 3318D Photoresist (Gallon)

AZ 3330F Photoresist (Gallon)

Typical Process

Soft Bake: 90-105C (60s)

Expose: g-line/i-line/h-line

Post Expose Bake: 110-115C

Develop: spray, puddle or immersion

Developer: MIF recommended

3312 Contact Hole SEM

0.5µm Holes in AZ 3312

1.10µm film thickness

140mJ/cm2 i-line exposure

0.54NA Stepper

AZ 300MIF Develop