AZ MiR 701 Series Photoresists are high resolution (0.35um design rules), i-line resists optimized for line/space and contact hole pattern layers. Low exposure dose requirements provide excellent throughput. Reliable performance in both dry and wet etch process environments. The MiR 701 Series covers a coated thickness range of approximately 0.5 to 2.5µm and works well with MIF developers (AZ 300MIF or AZ 726MIF recommended).

AZ MiR 701 Series Spin Curves

6" Si Wafers; Soft Bake 90C

Typical Process

Soft Bake: 90C (60s)

Expose: i-line/broadband

Post Expose Bake: 110C

Develop: spray or puddle

Developer: MIF recommended

Lines in MiR 701

0.32µm Lines in AZ MIR 701

0.97µm film thickness

180mJ/cm2 i-line exposure

0.60NA Stepper

AZ 300MIF Develop