AZ MIR 703 Series Photoresists are medium resolution (0.50µm design rules), i-line resists optimized for line and contact hole pattern layers. Low exposure dose requirements provide excellent throughput. Reliable performance in both dry and wet etch process environments. The AZ MiR 703 Series covers a coated thickness range of approximately 0.75 to 2.0µm and works well with MIF developers (AZ 300MIF or AZ 726MIF recommended)
6" Si Wafers; Soft Bake 90C
Typical Process
Soft Bake: 90C (60s)
Expose: g-line/i-line/h-line
Post Expose Bake: 110C
Develop: spray or puddle
Developer: MIF recommended
0.40µm Lines in AZ MIR 703
1.08µm film thickness
130mJ/cm2 i-line exposure
0.54NA Stepper
AZ 300MIF Develop