AZ MIR 703 Series Photoresists are medium resolution (0.50um design rules), i-line resists optimized for line and contact hole pattern layers. Low exposure dose requirements provide excellent throughput. Reliable performance in both dry and wet etch process environments. The AZ MiR 703 Series covers a coated thickness range of approximately 0.75 to 2.0µm and works well with MIF developers (AZ 300MIF or AZ 726MIF recommended)

AZ MiR 703 Series Spin Curves

6" Si Wafers; Soft Bake 90C

Typical Process

Soft Bake: 90C (60s)

Expose: g-line/i-line/h-line

Post Expose Bake: 110C

Develop: spray or puddle

Developer: MIF recommended


0.40µm Lines in AZ MIR 703

1.08µm film thickness

130mJ/cm2 i-line exposure

0.54NA Stepper

AZ 300MIF Develop