AZ MIR 900 Series Photoresists are general purpose high aspect ratio i-line resists optimized for line and contact hole pattern layers. Low exposure dose requirements provide excellent throughput. Reliable performance in dry etch, wet etch, plating, and implant process environments. The AZ MiR 900 Series covers a coated thickness range of approximately 1.7 to 7.0µm and works well with MIF developers (AZ 300MIF, AZ 726MIF, or 917MIF recommended).

AZ MiR 900 Series Spin Curves

6" Si Wafers; Soft Bake 90C

Typical Process

Soft Bake: 90C (60s)

Expose: g-line/i-line/h-line

Post Expose Bake: 110C

Develop: spray or puddle

Developer: MIF recommended


1.50µm Lines in AZ MIR 900

3.50µm film thickness

250mJ/cm2 i-line exposure

0.48NA Stepper

AZ 300MIF Develop