AZ MIR 900 Series Photoresists are general purpose high aspect ratio i-line resists optimized for line and contact hole pattern layers. Low exposure dose requirements provide excellent throughput. Reliable performance in dry etch, wet etch, plating, and implant process environments. The AZ MiR 900 Series covers a coated thickness range of approximately 1.7 to 7.0µm and works well with MIF developers (AZ 300MIF, AZ 726MIF, or 917MIF recommended).