AZ 15nXT Series Photoresists are cross linking negative tone materials optimized for use in plating, TSV, and RIE etch applications. The fully cross linked features are extremely thermally stable and etch resistant, yet strip quickly and easily in most common photoresist removers (AZ Remover 910 Stripper recommended). The 450cps version covers a coated film thickness range of approximately 5.5 to 14.0µm. Develop is very fast in standard MIF Developers (2.5 minutes in AZ 300MIF for a resist film thickness of 10.0µm).
6" Si Wafers; Soft Bake 110C
Items in this series
AZ 15nXT 115cps Photoresist (Quart)
AZ 15nXT 115cps Photoresist (Gallon)
AZ 15nXT 450cps Photoresist (Quart)
AZ 15nXT 450cps Photoresist (Gallon)
Typical Process
Soft Bake: 110C (180s)
Expose: i-line or broadband
Post Expose Bake: 120C
Develop: spray or puddle
Developer: AZ 300MIF
4.0µm Lines in AZ 15nXT on Cu
10.0µm film thickness
400mJ/cm2 i-line exposure
0.54NA Stepper
AZ 300MIF Develop (150s)