AZ 15nXT Series Photoresists are cross linking negative tone materials optimized for use in plating, TSV, and RIE etch applications. The fully cross linked features are extremely thermally stable and etch resistant, yet strip quickly and easily in most common photoresist removers (AZ 400T Stripper recommended). The 450cps version covers a coated film thickness range of approximately 5.5 to 14.0µm. Develop is very fast in standard MIF Developers (2.5 minutes in AZ 300MIF for a resist film thickness of 10.0µm).

AZ 15nXT Series Spin Curves

6" Si Wafers; Soft Bake 110C

Items in this series

AZ 15nXT 115cps Photoresist (Quart)

AZ 15nXT 115cps Photoresist (Gallon)

AZ 15nXT 450cps Photoresist (Quart)

AZ 15nXT 450cps Photoresist (Gallon)

Typical Process

Soft Bake: 110C (180s)

Expose: i-line or broadband

Post Expose Bake: 120C

Develop: spray or puddle

Developer: AZ 300MIF


4.0µm Lines in AZ 15nXT on Cu

10.0µm film thickness

400mJ/cm2 i-line exposure

0.54NA Stepper

AZ 300MIF Develop (150s)