AZ 50XT Photoresist is a thick DNQ type resist optimized for MEMs and packaging (solder bump, etc.) applications. Single coat film thicknesses of 15 to 65µm are achievable on standard coating equipment. Superior adhesion to Cu substrates prevents under-plating and removal is easy using AZ 400T Stripper. Compatible with inorganic developers (AZ 421K or AZ 400K 1:3 recommended).
6" Si Wafers
Items in this series
AZ 50XT Photoresist (Quart)
AZ 50XT Photoresist (Gallon)
Typical Process
Soft Bake: 85/125C
Expose: broadband
Post Expose Bake: None
Develop: spray/immersion
Developer: AZ 421K
60µm holes in AZ 50XT
65µm film thickness
1400mJ/cm2 broadband
Suss MA 200 aligner
AZ 421K Develop