AZ IPS-6000 is an advanced chemically amplified positive tone photoresist optimized for use in high aspect ratio plating, MEMs, and extreme RIE etch applications. AZ IPS-6000 is fast, MIF developer compatible and requires no post bake re-hydration delays. Film thicknesses from 20 to 120+µm are achievable. Develop in AZ 300MIF or 917MIF developer. Strips easily in AZ 400T Stripper.

AZ IPS6000

AZ 300MIF Develop

Typical Process

Soft Bake: 125C

Expose: i-line or broadband

PEB: 105C

Develop: spray/puddle

Developer: AZ 300MIF

60µm Cu stud post strip