AZ® IPS-6000 Series Photoresist
AZ IPS-6000 is an advanced chemically amplified positive tone photoresist optimized for use in high aspect ratio plating, MEMs, and extreme RIE etch applications. AZ IPS-6000 is fast, MIF developer compatible and requires no post bake re-hydration delays. Film thicknesses from 20 to 120+µm are achievable. Develop in AZ 300MIF or 917MIF developer. Strips easily in AZ 400T Stripper.
Typical Process
Soft Bake: 125C
Expose: i-line or broadband
PEB: 105C
Develop: spray/puddle
Developer: AZ 300MIF