AZ 10XT Series Photoresists are general purpose i-line/h-line sensitive materials engineered for performance in most electro-plating and other metal deposition process environments. Coated thickness range is approximately 2.0 to 20µm (single coat). Optimized for the AZ 400K developers (AZ 400K 1:4 or AZ 400K 1:3). MIF developers not recommended. Similar processing but improved resolution and aspect ratios vs. the AZ P4000 series.

AZ 9200SpinCurves

6" Si Wafers

Items in this series

AZ 10XT-520cPs Photoresist (Gallon)

AZ 10XT-220cPs Photoresist (Gallon)

Typical Process

Soft Bake: 110C

Expose: g/h line

Post Expose Bake: Optional

Develop: spray/immersion

Developer: AZ 400K 1:3 or AZ 400K 1:4


2.0µm Lines in AZ 10XT-520cPs

6.0µm film thickness

380mJ/cm2 i-line exposure

0.48NA Stepper

AZ 400K 1:4 Develop