AZ 10XT Series Photoresists are general purpose i-line/h-line sensitive materials engineered for performance in most electro-plating and other metal deposition process environments. Coated thickness range is approximately 2.0 to 20µm (single coat). Optimized for the AZ 400K developers (AZ 400K 1:4 or AZ 400K 1:3). MIF developers not recommended. Similar processing but improved resolution and aspect ratios vs. the AZ P4000 series.
6" Si Wafers
Items in this series
AZ 10XT-520cPs Photoresist (Gallon)
AZ 10XT-520cPs Photoresist (Quart)
AZ 10XT-220cPs Photoresist (Gallon)
Typical Process
Soft Bake: 110C
Expose: g/h line
Post Expose Bake: Optional
Develop: spray/immersion
Developer: AZ 400K 1:3 or AZ 400K 1:4
2.0µm Lines in AZ 10XT-520cPs
6.0µm film thickness
380mJ/cm2 i-line exposure
0.48NA Stepper
AZ 400K 1:4 Develop